• Visualizing the colonization dynamics of pathogenic bacteria labelled by upconverting nanoparticles inside the gut 

  Dumlupinar, Gokhan; Singh, Raminder; Komolibus, Katarzyna; Melgar, Silvia; Andersson-Engels, Stefan (Optical Society of America, 2019)

  This study intends to show the use of upconversion photoluminescence imaging to investigate the colonization and infection dynamics of a natural murine intestinal pathogen, Citrobacter rodentium (C. rodentium), which induces ...
• Pluggable silicon photonic MEMS switch package for data centre 

  Hwang, How Yuan; Lee, Jun Su; Henriksson, Johannes; Kwon, Kyungmok; Seok, Tae Joon; Wu, Ming C.; O'Brien, Peter A. (Institute of Electrical and Electronics Engineers (IEEE), 2018-12)

  Consumers' thirst for data has led to the development of various silicon photonic switching devices that are highly scalable while maintaining their relatively compact form factor at the same time. This demands a paradigm ...
• Parametric study of different shapes-slotted substrate integrated waveguide for wideband applications 

  Nakmouche, M. F.; Taher, Hany; Fawzy, D. E.; Kahraman, G. (Institute of Electrical and Electronics Engineers (IEEE), 2019-01-17)

  On the way to design Substrate Integrated Waveguide Bandpass Filter (SIW-BPF) for wideband applications a parametric study of the slot geometry etched on a SIW structure is the preliminary step to design such filter. Three ...
• Stress modelling of multi level interconnect schemes for future deep submicron device generations 

  Gonzales Montes DeOca, Carlos; Foley, Sean; Mathewson, Alan; Rohan, James F. (Springer, 2001-09)

  Copper and low dielctric constantant (k) materials are poised to become the dominant interconnect scheme for integrated circuits for the future because of the low resistance and capacitance that they offer which can improve ...
• 3D interconnection by FIB assisted Pt deposition and electroless nickel deposition on the sides and edges of an I-Seed 

  Razeeb, Kafil M.; Nagle, Lorraine C.; Barton, John; Tassie, Paul; O'Flynn, Brendan; Rohan, James F.; Ó Mathúna, S. Cian (Institute of Electrical and Electronics Engineers (IEEE), 2006-05)

  This paper reports on the development of a 3D interconnection process leading to the successful assembly of a five-layer 3-D 1mm cube module. This proof of concept module demonstrates the capability for successful integration ...

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