Power inside - applications and technologies for integrated power in microelectronics
Ó Mathúna, S. Cian; Kulkarni, Santosh; Pavlović, Zoran; Casey, Declan P.; Rohan, James F.; Kelleher, Anne-Marie; Maxwell, Graeme; O'Brien, Joe; McCloskey, Paul
Date:
2017-12
Copyright:
© 2017 IEEE. Personal use of this material is permitted. Permission from IEEE must be obtained for all other uses, in any current or future media, including reprinting/republishing this material for advertising or promotional purposes, creating new collective works, for resale or redistribution to servers or lists, or reuse of any copyrighted component of this work in other works.
Citation:
Ó Mathúna, C., Kulkarni, S., Pavlovic, Z., Casey, D., Rohan, J., Kelleher, A., Maxwell, G., Brien, J. O. and McCloskey, P. (2017) 'Power inside — Applications and technologies for integrated power in microelectronics', 2017 IEEE International Electron Devices Meeting (IEDM), San Francisco, CA, USA, 02-06 December, pp. 3.3.1-3.3.4. doi: 10.1109/IEDM.2017.8268318
Abstract:
The emergence of miniaturized and integrated Power Supply on Chip (PwrSoC) and Power Supply in Package (PwrSiP) platforms will be enabled by the application of thin-film, integrated magnetics on silicon. A process flow for, and the design of, a thin-film coupled-inductor, switching at 60MHz, is described. Based on the large signal characterization data, measured up to 100MHz, the efficiency of the inductor is calculated to be 91.7% for a power of 0.5W.
Show full item record
