Power inside - applications and technologies for integrated power in microelectronics

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Date
2017-12
Authors
Ó Mathúna, S. Cian
Kulkarni, Santosh
Pavlović, Zoran
Casey, Declan P.
Rohan, James F.
Kelleher, Anne-Marie
Maxwell, Graeme
O'Brien, Joe
McCloskey, Paul
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Volume Title
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Published Version
10.1109/IEDM.2017.8268318
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Abstract
The emergence of miniaturized and integrated Power Supply on Chip (PwrSoC) and Power Supply in Package (PwrSiP) platforms will be enabled by the application of thin-film, integrated magnetics on silicon. A process flow for, and the design of, a thin-film coupled-inductor, switching at 60MHz, is described. Based on the large signal characterization data, measured up to 100MHz, the efficiency of the inductor is calculated to be 91.7% for a power of 0.5W.
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Keywords
Inductors , Power system management , Magnetic cores , Inductance , Windings , System-on-chip , Inductors , Power supply circuits , Silicon , System-on-chip , Integrated magnetics , Microelectronics , Integrated power supply on chip , PwrSoC , Power supply in package platforms , PwrSiP platforms , Thin-film coupled-inductor , Frequency 60.0 MHz , Frequency 100.0 MHz
Citation
Ó Mathúna, C., Kulkarni, S., Pavlovic, Z., Casey, D., Rohan, J., Kelleher, A., Maxwell, G., Brien, J. O. and McCloskey, P. (2017) 'Power inside — Applications and technologies for integrated power in microelectronics', 2017 IEEE International Electron Devices Meeting (IEDM), San Francisco, CA, USA, 02-06 December, pp. 3.3.1-3.3.4. doi: 10.1109/IEDM.2017.8268318
Link to publisher’s version
https://ieeexplore.ieee.org/document/8268318
URI
https://hdl.handle.net/10468/7673
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Tyndall National Institute - Conference Items
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