Power inside - applications and technologies for integrated power in microelectronics
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Accepted version
Date
2017-12
Authors
Ó Mathúna, S. Cian
Kulkarni, Santosh
Pavlović, Zoran
Casey, Declan P.
Rohan, James F.
Kelleher, Anne-Marie
Maxwell, Graeme
O'Brien, Joe
McCloskey, Paul
Journal Title
Journal ISSN
Volume Title
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Published Version
Abstract
The emergence of miniaturized and integrated Power Supply on Chip (PwrSoC) and Power Supply in Package (PwrSiP) platforms will be enabled by the application of thin-film, integrated magnetics on silicon. A process flow for, and the design of, a thin-film coupled-inductor, switching at 60MHz, is described. Based on the large signal characterization data, measured up to 100MHz, the efficiency of the inductor is calculated to be 91.7% for a power of 0.5W.
Description
Keywords
Inductors , Power system management , Magnetic cores , Inductance , Windings , System-on-chip , Inductors , Power supply circuits , Silicon , System-on-chip , Integrated magnetics , Microelectronics , Integrated power supply on chip , PwrSoC , Power supply in package platforms , PwrSiP platforms , Thin-film coupled-inductor , Frequency 60.0 MHz , Frequency 100.0 MHz
Citation
Ó Mathúna, C., Kulkarni, S., Pavlovic, Z., Casey, D., Rohan, J., Kelleher, A., Maxwell, G., Brien, J. O. and McCloskey, P. (2017) 'Power inside — Applications and technologies for integrated power in microelectronics', 2017 IEEE International Electron Devices Meeting (IEDM), San Francisco, CA, USA, 02-06 December, pp. 3.3.1-3.3.4. doi: 10.1109/IEDM.2017.8268318
Copyright
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