Thin silicon in a novel 3-D format for implementation in distributed autonomous micro modules

Cussen, Teresa; Majeed, Bivragh; Delaney, Kieran; Ó Mathúna, S. Cian

Thin silicon in a novel 3-D format for implementation in distributed autonomous micro modules

Files

10173.pdf(117.66 KB)

Published version

Date

2002-09

Authors

Cussen, Teresa

Majeed, Bivragh

Delaney, Kieran

Ó Mathúna, S. Cian

Publisher

Viktoria Institute, Göteborg, Sweden

Abstract

Silicon thinning, interconnection and packaging are key innovative hardware technologies that can be used to realise distributed autonomous micro-modules (DAMM) for future ad-hoc networks in ambient systems and intelligent environments. These would interact, respond and learn from their surroundings making integration of engineering, computer science and human intelligence a reality. This paper investigates thinning silicon sensors and packaging these sensors in a tetrahedral format. This form was chosen because it is vastly expandable and when miniaturised can be used as a building block for DAMM’s, which can be designed to physically integrate into materials from which artefacts are fabricated.

Keywords

Thin silicon , 3-D packaging , Flip chip , Micro-modules

Citation

Cussen, T., Majeed, B., Delaney, K. and Ó Mathuna, S. Cian (2002) 'Thin Silicon in a Novel 3-D Format for Implementation in Distributed Autonomous Micro Modules', UbiComp 2002: Fourth International Conference on Ubiquitous Computing, Goteberg, Sweden, 29 September - 1 October, pp. 49-50.