Thin silicon in a novel 3-D format for implementation in distributed autonomous micro modules

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Date
2002-09
Authors
Cussen, Teresa
Majeed, Bivragh
Delaney, Kieran
Ó Mathúna, S. Cian
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Viktoria Institute, Göteborg, Sweden
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Abstract
Silicon thinning, interconnection and packaging are key innovative hardware technologies that can be used to realise distributed autonomous micro-modules (DAMM) for future ad-hoc networks in ambient systems and intelligent environments. These would interact, respond and learn from their surroundings making integration of engineering, computer science and human intelligence a reality. This paper investigates thinning silicon sensors and packaging these sensors in a tetrahedral format. This form was chosen because it is vastly expandable and when miniaturised can be used as a building block for DAMM’s, which can be designed to physically integrate into materials from which artefacts are fabricated.
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Keywords
Thin silicon , 3-D packaging , Flip chip , Micro-modules
Citation
Cussen, T., Majeed, B., Delaney, K. and Ó Mathuna, S. Cian (2002) 'Thin Silicon in a Novel 3-D Format for Implementation in Distributed Autonomous Micro Modules', UbiComp 2002: Fourth International Conference on Ubiquitous Computing, Goteberg, Sweden, 29 September - 1 October, pp. 49-50.
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© 2002 The Authors.