Scale up of advanced packaging and system integration for hybrid technologies

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dc.contributor.authorSelim, Ramsey
dc.contributor.authorHoofman, Romano
dc.contributor.authorLabie, Riet
dc.contributor.authorSandeep, Veda
dc.contributor.authorDrischel, Thomas
dc.contributor.authorTorki, Kholdoun
dc.contributor.funderHorizon 2020en
dc.date.accessioned2021-10-01T09:05:55Z
dc.date.available2021-10-01T09:05:55Z
dc.date.issued2021-07-02
dc.date.updated2021-09-29T15:07:06Z
dc.description.abstractThis paper presents an overview of challenges in system integration for 2.5D/3D assemblies, including copackaged optics and electronics, MEMS and microfluidics. It addresses the gap between early-stage prototypes and volume manufacturing that need true advanced packaging and system integration to realize their complex multi-technology devices. This is done by means of a virtual demonstrator that include both 2.5D/3D assemblies of ASICs and integrated photonic devices, as well as MEMS and microfluidics devices. It also addresses lowering the cost barrier for users accessing these technologies for their products, such that it will enable an increased uptake of system integration by the industry at large.en
dc.description.statusPeer revieweden
dc.description.versionAccepted Versionen
dc.format.mimetypeapplication/pdfen
dc.identifier.citationSelim, R., Hoofman, R., Labie, R., Sandeep, V., Drischel, T. and Torki, K. (2021) 'Scale up of advanced packaging and system integration for hybrid technologies', 2021 Smart Systems Integration, Grenoble, France, 27-29 April. doi: 10.1109/SSI52265.2021.9467004en
dc.identifier.doi10.1109/SSI52265.2021.9467004en
dc.identifier.endpage4en
dc.identifier.isbn978-1-6654-3117-0
dc.identifier.isbn978-1-6654-4092-9
dc.identifier.startpage1en
dc.identifier.urihttps://hdl.handle.net/10468/12038
dc.language.isoenen
dc.publisherInstitute of Electrical and Electronics Engineers (IEEE)en
dc.relation.ispartof2021 Smart Systems Integration (SSI)
dc.relation.projectinfo:eu-repo/grantAgreement/EC/H2020::RIA/768686/EU/An integrated POC solution for non-invasive diagnosis and therapy monitoring of Heart Failure patients/KardiaToolen
dc.relation.projectinfo:eu-repo/grantAgreement/EC/H2020::IA/825121/EU/Next Europractice eXtended Technologies and Services: “The access point for the future generation of electronic components and systems”/NEXTSen
dc.rights© 2021, IEEE. Personal use of this material is permitted. Permission from IEEE must be obtained for all other uses, in any current or future media, including reprinting/republishing this material for advertising or promotional purposes, creating new collective works, for resale or redistribution to servers or lists, or reuse of any copyrighted component of this work in other works.en
dc.subject2.5/3D integrationen
dc.subjectCost sharingen
dc.subjectMEMSen
dc.subjectMicrofluidicsen
dc.subjectMPW runsen
dc.subjectPhotonics packagingen
dc.subjectSystem integrationen
dc.titleScale up of advanced packaging and system integration for hybrid technologiesen
dc.typeConference itemen
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