Integration of quantum dot lasers with SOI waveguides using micro-transfer printing

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dc.contributor.authorUzun, Alien
dc.contributor.authorAtar, Fatihen
dc.contributor.authorJustice, Johnen
dc.contributor.authorLoi, Ruggeroen
dc.contributor.authorFarrell, Alexen
dc.contributor.authorOssieur, Peteren
dc.contributor.authorZhang, Jingen
dc.contributor.authorRoelkens, Guntheren
dc.contributor.authorKrestnikov, Igoren
dc.contributor.authorRimböck, Johannaen
dc.contributor.authorErlt, Stefanen
dc.contributor.authorPantouvaki, Mariannaen
dc.contributor.authorLepage, Guyen
dc.contributor.authorVan Campenhout, Jorisen
dc.contributor.authorCorbett, Brianen
dc.contributor.funderScience Foundation Irelanden
dc.contributor.funderHorizon 2020en
dc.date.accessioned2024-01-30T14:28:19Z
dc.date.available2024-01-30T14:28:19Z
dc.date.issued2022en
dc.description.abstractWe demonstrate the integration of long (2.4 mm) 1.3 μm etched facet quantum dot (QD) laser diodes into 7 μm deep recesses on an SOI wafer by micro transfer printing (μTP). Inverse tapered waveguide couplers were used to edge-couple the light from the QD laser to the 220 nm thick Si waveguide layer. Characterization exhibits that the QD lasers with 2 mm cavity length have threshold currents ~20 mA with output powers above 10 mW at 80 mA. A waveguide-coupled power of ~1mW was obtained.en
dc.description.statusPeer revieweden
dc.description.versionAccepted Versionen
dc.format.mimetypeapplication/pdfen
dc.identifier.articleidT.E.4en
dc.identifier.citationUzun, A., Atar, F., Justice, J., Loi, R., Farrell, A., Ossieur, P., Zhang, J., Roelkens, G., Krestnikov, I., Rimböck, J., Erlt, S., Pantouvaki, M., Lepage, G., Van Campenhout, J. and Corbett, B. (2022) 'Integration of quantum dot lasers with SOI waveguides using micro-transfer printing', 23rd European Conference on Integrated Optics (ECIO 2022), Milan, Italy, 4-6 May. Available at: https://www.ecio-conference.org/wp-content/uploads/2022/07/ECIO_proceedingsv3.pdf (Accessed: 30 January 2024).en
dc.identifier.endpage290en
dc.identifier.startpage288en
dc.identifier.urihttps://hdl.handle.net/10468/15453
dc.language.isoenen
dc.relation.ispartof23rd European Conference on Integrated Optics (ECIO 2022), Milan, Italy, 4-6 May 2022en
dc.relation.projectinfo:eu-repo/grantAgreement/EC/H2020::IA/825453/EU/Micro assembled Terabit/s capable optical transceivers for Datacom applications/Caladanen
dc.relation.projectinfo:eu-repo/grantAgreement/SFI/SFI Research Centres Programme::Phase 2/12/RC/2276_P2/IE/IPIC_Phase 2/en
dc.relation.urihttps://www.ecio-conference.org/wp-content/uploads/2022/07/ECIO_proceedingsv3.pdfen
dc.rights© 2022, the Authors.en
dc.subjectButt couplingen
dc.subjectQuantum dot laser diodesen
dc.subjectSilicon photonicsen
dc.subjectTransfer printingen
dc.titleIntegration of quantum dot lasers with SOI waveguides using micro-transfer printingen
dc.typeConference itemen
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