High-speed electro-absorption modulator assisted by iron doping for micro-transfer-printing integration
dc.contributor.author | Shi, Shengtai | en |
dc.contributor.author | Mulcahy, Jack | en |
dc.contributor.author | Dai, Xing | en |
dc.contributor.author | Peters, Frank H. | en |
dc.contributor.funder | Science Foundation Ireland | en |
dc.contributor.funder | Engineering and Physical Sciences Research Council | en |
dc.date.accessioned | 2024-07-18T10:49:51Z | |
dc.date.available | 2024-07-18T10:49:51Z | |
dc.date.issued | 2024-06-10 | en |
dc.description.abstract | A high-speed lumped-element electro-absorption modulator designed for micro-transfer-printing onto silicon has been tested. The modulators use an iron doped layer to reduce the parasitic capacitance of the devices after transfer-printing, which is beneficial for achieving high bandwidth for heterogeneous integration applications with silicon photonics. | en |
dc.description.status | Peer reviewed | en |
dc.description.version | Accepted Version | en |
dc.format.mimetype | application/pdf | en |
dc.identifier.citation | Shi, S., Mulcahy, J., Dai, X. and Peters, F. H. (2024) 'High-speed electro-absorption modulator assisted by iron doping for micro-transfer-printing integration', 2024 IEEE Silicon Photonics Conference (SiPhotonics), Tokyo Bay, Japan, 15-18 April, pp. 1-2. doi: https://doi.org/10.1109/SiPhotonics60897.2024.10544327 | en |
dc.identifier.doi | https://doi.org/10.1109/SiPhotonics60897.2024.10544327 | en |
dc.identifier.eissn | 1949-209X | en |
dc.identifier.endpage | 2 | en |
dc.identifier.isbn | 979-8-3503-9404-7 | en |
dc.identifier.isbn | 979-8-3503-9405-4 | en |
dc.identifier.issn | 1949-2081 | en |
dc.identifier.startpage | 1 | en |
dc.identifier.uri | https://hdl.handle.net/10468/16140 | |
dc.language.iso | en | en |
dc.publisher | Institute of Electrical and Electronics Engineers (IEEE) | en |
dc.relation.ispartof | 2024 IEEE Silicon Photonics Conference (SiPhotonics), Tokyo Bay, Japan, 15-18 April 2024 | en |
dc.relation.project | info:eu-repo/grantAgreement/SFI/SFI Research Centres Programme::Phase 2/12/RC/2276_P2/IE/IPIC_Phase 2/ | en |
dc.rights | © 2024, IEEE. Personal use of this material is permitted. Permission from IEEE must be obtained for all other uses, in any current or future media, including reprinting/republishing this material for advertising or promotional purposes, creating new collective works, for resale or redistribution to servers or lists, or reuse of any copyrighted component of this work in other works. | en |
dc.subject | Modulator | en |
dc.subject | Heterogeneous integration | en |
dc.subject | Micro transfer printing | en |
dc.subject | High-speed photonics | en |
dc.title | High-speed electro-absorption modulator assisted by iron doping for micro-transfer-printing integration | en |
dc.type | Conference item | en |
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