Harsh environments minimally invasive optical sensing technique for extreme temperatures: 1000 degrees C and approaching 2500 degrees C
Riza, Nabeel A.
Arain, Muzamil A.
Society of Photo-optical Instrumentation Engineers (SPIE)
To the best of our knowledge, for the first time is designed and demonstrated a single crystal Silicon Carbide (SiC)-based minimally invasive smart optical sensor suited for harsh environments and temperatures reaching 2500 °C. The novel sensor design is based on an agile wavelength source, instantaneous single wavelength interferometry, full optical power cycle data acquisition, free-space targeted laser beam, multiple single crystal thick SiC optical frontend chips, and multi-wavelength signal processing for unambiguous temperature measurements to form a fast and distributed smart optical sensor system. Experiments conducted using a 1550 nm eye safe band tunable laser and a 300 micron coating-free thick SiC chip demonstrate temperature sensing from room temperature to 1000 °C with a measured 1.3 °C resolution. Applications for the proposed sensor include use in fossil fuel-based power systems, aerospace/aircraft systems, satellite systems, deep space exploration systems, and drilling and oil mining industries.
High temperature sensor , Harsh environment , Optical sensor , Silicon Carbide , Sensors , Temperature metrology , Fabry–Perot interferometers , Crystals , Optical sensors , Environmental sensing , Environmental sensing
Riza, N. A., Arain, M. and Perez, F. (2005) 'Harsh environments minimally invasive optical sensing technique for extreme temperatures: 1000 degrees C and approaching 2500 degrees C', Proceeedings of SPIE, 5855, 17th International Conference on Optical Fibre Sensors, Bruges, Belgium, 23 May, pp. 687-690. doi: 10.1117/12.623399
© 2005 Society of Photo-Optical Instrumentation Engineers (SPIE). One print or electronic copy may be made for personal use only. Systematic reproduction and distribution, duplication of any material in this paper for a fee or for commercial purposes, or modification of the content of the paper are prohibited.