High frequency DC-DC converter with co-packaged planar inductor and power IC

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dc.contributor.authorWang, Ningning
dc.contributor.authorBarry, John
dc.contributor.authorHannon, Jason
dc.contributor.authorKulkarni, Santosh
dc.contributor.authorFoley, Ray
dc.contributor.authorMcCarthy, Kevin G.
dc.contributor.authorRodgers, Kenneth
dc.contributor.authorWaldron, Finbarr
dc.contributor.authorBarry, Mark
dc.contributor.authorCasey, Declan P.
dc.contributor.authorRohan, James F.
dc.contributor.authorO'Brian, Joe
dc.contributor.authorHegarty, Margaret
dc.contributor.authorKelleher, Ann-Marie
dc.contributor.authorRoy, Saibal
dc.contributor.authorÓ Mathúna, S. Cian
dc.contributor.funderEnterprise Irelanden
dc.contributor.funderScience Foundation Irelanden
dc.contributor.funderMicroelectronics Circuits Center Ireland
dc.date.accessioned2019-03-26T10:08:15Z
dc.date.available2019-03-26T10:08:15Z
dc.date.issued2013-05
dc.date.updated2019-03-26T09:43:47Z
dc.description.abstractThe paper introduces the trend of integration and miniaturization of power converters with potential for enhanced efficiency, form factor reduction and cost reduction. To demonstrate the concept of highly integrated switched mode power supply with integrated magnetic, a system-in-package DC-DC converter using a stacked co-packaging approach is developed. A system approach was taken to the design, and functional integration, using 3-D packaging for realizing a power supply in package solution (PwrSiP). The target integrated converter is capable of handling an input voltage of 5V and frequencies up to 40MHz. A DC-DC converter IC on a 0.35μm CMOS process was designed to meet this goal. In parallel with the IC design, technology development for on-silicon integrated micro-inductors was completed to achieve small-form factor and extremely low profile. A maximum measured efficiency of 83% and 78% was achieved on the stacked converter operating at 20MHz and 40MHz, respectively. The stacked approach showed a 30% area reduction compared to side-by-side implementation with external discrete inductor.en
dc.description.sponsorshipEnterprise Ireland and Microelectronics Circuits Center Ireland (Project CC-2008-2403); Science Foundation Ireland (National Access Program: Project NAP412)en
dc.description.statusPeer revieweden
dc.description.versionAccepted Versionen
dc.format.mimetypeapplication/pdfen
dc.identifier.citationWang, N., Barry, J., Hannon, J., Kulkarni, S., Foley, R., McCarthy, K., Rodgers, K., Waldron, F., Barry, M., Casey, D., Rohan, J., O'Brian, J., Hegarty, M., Kelleher, A.-M., Roy, S. and Ó Mathúna, C. (2013) ‘High frequency DC-DC converter with co-packaged planar inductor and power IC’, 2013 IEEE 63rd Electronic Components and Technology Conference, Las Vegas, NV, USA, 28-31 May, pp. 1946-1952. doi:10.1109/ECTC.2013.6575844en
dc.identifier.doi10.1109/ECTC.2013.6575844
dc.identifier.endpage1952en
dc.identifier.isbn978-1-4799-0233-0
dc.identifier.isbn978-1-4799-0232-3
dc.identifier.issn2377-5726
dc.identifier.issn0569-5503
dc.identifier.startpage1946en
dc.identifier.urihttps://hdl.handle.net/10468/7675
dc.language.isoenen
dc.publisherInstitute of Electrical and Electronics Engineers (IEEE)en
dc.relation.ispartof2013 IEEE 63rd Electronic Components and Technology Conference
dc.relation.urihttps://ieeexplore.ieee.org/document/6575844
dc.rights© 2013, IEEE. Personal use of this material is permitted. Permission from IEEE must be obtained for all other uses, in any current or future media, including reprinting/republishing this material for advertising or promotional purposes, creating new collective works, for resale or redistribution to servers or lists, or reuse of any copyrighted component of this work in other works.en
dc.subjectCMOS integrated circuitsen
dc.subjectDC-DC power convertorsen
dc.subjectInductorsen
dc.subjectIntegrated circuit designen
dc.subjectPower integrated circuitsen
dc.subjectSystem-in-packageen
dc.subjectDC-DC converteren
dc.subjectPlanar inductoren
dc.subjectPower ICen
dc.subjectPower convertersen
dc.subjectForm factor reductionen
dc.subjectCost reductionen
dc.subjectSwitched mode power supplyen
dc.subjectPower supply in package solutionen
dc.subjectPwrSiPen
dc.subjectCMOS processen
dc.subjectIC designen
dc.subjectOn-silicon integrated micro-inductorsen
dc.subjectVoltage 5 Ven
dc.subjectFrequency 40 MHzen
dc.subjectSize 0.35 mumen
dc.subjectFrequency 20 MHzen
dc.subjectIntegrated circuitsen
dc.subjectWiresen
dc.subjectMagnetic coresen
dc.subjectShift registersen
dc.subjectResistanceen
dc.subjectInductanceen
dc.titleHigh frequency DC-DC converter with co-packaged planar inductor and power ICen
dc.typeConference itemen
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