A study on a tether-less approach towards micro-transfer-printing of large-footprint power micro-inductor chiplets

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dc.contributor.authorPal, Somnathen
dc.contributor.authorYe, Liangen
dc.contributor.authorO'Callaghan, Jamesen
dc.contributor.authorAtar, Fatih Bilgeen
dc.contributor.authorO'Mathuna, Cianen
dc.contributor.authorCorbett, Brianen
dc.contributor.authorSai, Ranajiten
dc.contributor.authorKhan, Sambuddhaen
dc.contributor.funderEnterprise Irelanden
dc.date.accessioned2024-01-15T14:24:44Z
dc.date.available2024-01-15T14:24:44Z
dc.date.issued2023-06-26en
dc.description.abstractIn recent years, need for large-scale, multi-layer, high-capacity integration for electronic systems has sky-rocketed. In this regard, a novel heterogeneous integration technique called Micro-transfer-printing (μTP) has attracted a lot of attention due to its unique ability to integrate chiplets from heterogeneous sources on to a target substrate. Typically, the chiplets are picked up from a donor substrate using an elastomer stamp by breaking the surrounding micro-tethers and then printed onto a target substrate for further processing. Despite its success in applications like sensors, photovoltaics, photonics, etc., μTP finds its limitation in handling chiplet dimensions larger than 100 x 100 x 20 μm3 . Therefore, reports on μTP of passive components like micro-inductors and micro-transformers with dimension in mm x mm and thickness of 100s of μm are non-existent. In this paper, a completely novel, non-classical, tether-less approach has been demonstrated for micro-inductors with large footprint. This paper also reports a customized PDMS stamp fabrication and optimized post-fabrication sample preparation steps, such as, substrate thinning and polishing while retaining device performance intact.en
dc.description.sponsorshipEnterprise Ireland (DTIF project - TAPESTRY)en
dc.description.statusPeer revieweden
dc.description.versionAccepted Versionen
dc.format.mimetypeapplication/pdfen
dc.identifier.citationPal, S., Ye, L., O'Callaghan, J., Atar, F. B., O'Mathuna, C., Corbett, B., Sai, R. and Khan, S. (2023) 'A study on a tether-less approach towards micro-transfer-printing of large-footprint power micro-inductor chiplets', 2023 IEEE International 3D Systems Integration Conference (3DIC), Cork, Ireland, 10-12 May, pp.1-4. https://doi.org/10.1109/3DIC57175.2023.10155034en
dc.identifier.doihttps://doi.org/10.1109/3DIC57175.2023.10155034en
dc.identifier.eissn2836-4902en
dc.identifier.endpage4en
dc.identifier.isbn979-8-3503-1137-2en
dc.identifier.isbn979-8-3503-1138-9en
dc.identifier.issn2164-0157en
dc.identifier.startpage1en
dc.identifier.urihttps://hdl.handle.net/10468/15366
dc.language.isoenen
dc.publisherInstitute of Electrical and Electronics Engineers (IEEE)en
dc.relation.ispartof2023 IEEE International 3D Systems Integration Conference (3DIC), Cork, Ireland, 10-12 Mayen
dc.rights© 2023, IEEE. Personal use of this material is permitted. Permission from IEEE must be obtained for all other uses, in any current or future media, including reprinting/republishing this material for advertising or promotional purposes, creating new collective works, for resale or redistribution to servers or lists, or reuse of any copyrighted component of this work in other works.en
dc.subjectMicro-transfer-printingen
dc.subjectμTPen
dc.subjectMicro-inductoren
dc.subjectHeterogeneous integrationen
dc.subjectTether-lessen
dc.subjectLarge-footprint chipleten
dc.subjectPDMS stampen
dc.titleA study on a tether-less approach towards micro-transfer-printing of large-footprint power micro-inductor chipletsen
dc.typeConference itemen
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