128 × 128 silicon photonic MEMS switch package using glass interposer and pitch reducing fibre array

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dc.contributor.authorHwang, How Yuan
dc.contributor.authorMorrissey, Padraic E.
dc.contributor.authorLee, Jun Su
dc.contributor.authorO'Brien, Peter A.
dc.contributor.authorHenriksson, Johannes
dc.contributor.authorWu, Ming C.
dc.contributor.authorSeok, Tae Joon
dc.contributor.funderScience Foundation Irelanden
dc.date.accessioned2018-08-24T10:31:34Z
dc.date.available2018-08-24T10:31:34Z
dc.date.issued2017-12
dc.date.updated2018-08-24T09:29:20Z
dc.description.abstractWe design and fabricate the packaging of 128 × 128 silicon photonic MEMS switch device using through glass via (TGV) interposer and pitch reducing fibre array. The switch device contains 16384 MEMS switch cells and 272 grating couplers spaced at 63.5 μm in a compact footprint of 17.4 mm × 16 mm. The apodised grating couplers designed for 1300 nm have an insertion loss of 2.5 dB/facet at 10° coupling angle. The 0.5 mm thick glass interposer contains 512 electrical vias while the pitch reducing optical coupling array is polished to 40° for planar coupling.en
dc.description.statusPeer revieweden
dc.description.versionAccepted Versionen
dc.format.mimetypeapplication/pdfen
dc.identifier.citationHwang, H. Y., Morrissey, P., Lee, J. S., Brien, P. O., Henriksson, J., Wu, M. C. and Seok, T. J. (2017) '128 × 128 silicon photonic MEMS switch package using glass interposer and pitch reducing fibre array', 2017 19th Electronics Packaging Technology Conference, Singapore, 6-9 Dec. (4 pp). doi:10.1109/EPTC.2017.8277436en
dc.identifier.doi10.1109/EPTC.2017.8277436
dc.identifier.endpage4en
dc.identifier.isbn978-1-5386-3042-6
dc.identifier.isbn978-1-5386-3041-9
dc.identifier.issn978-1-5386-3043-3
dc.identifier.journaltitle2017 19th Electronics Packaging Technology Conferenceen
dc.identifier.startpage1en
dc.identifier.urihttps://hdl.handle.net/10468/6637
dc.language.isoenen
dc.publisherInstitute of Electrical and Electronics Engineers (IEEE)en
dc.relation.ispartof2017 IEEE 19th Electronics Packaging Technology Conference (EPTC)
dc.relation.projectinfo:eu-repo/grantAgreement/SFI/SFI Research Centres/12/RC/2276/IE/I-PIC Irish Photonic Integration Research Centre/en
dc.relation.urihttps://ieeexplore.ieee.org/document/8277436/?section=abstract
dc.rights© 2017 IEEE. Personal use of this material is permitted. Permission from IEEE must be obtained for all other uses, in any current or future media, including reprinting/republishing this material for advertising or promotional purposes, creating new collective works, for resale or redistribution to servers or lists, or reuse of any copyrighted component of this work in other works.en
dc.subjectDiffraction gratingsen
dc.subjectElemental semiconductorsen
dc.subjectIntegrated opticsen
dc.subjectIntegrated optoelectronicsen
dc.subjectMicro-optomechanical devicesen
dc.subjectMicroswitchesen
dc.subjectOptical communication equipmenten
dc.subjectOptical design techniquesen
dc.subjectOptical fibre couplersen
dc.subjectOptical fibre lossesen
dc.subjectOptical switchesen
dc.subjectSiliconen
dc.subjectSilicon photonic MEMS switch packageen
dc.subjectPitch reducing fibre arrayen
dc.subjectInsertion lossen
dc.subjectPlanar couplingen
dc.subjectOptical coupling arrayen
dc.subjectApodised grating couplersen
dc.subjectSwitch deviceen
dc.subjectGlass interposeren
dc.subjectSize 63.5 mumen
dc.subjectSize 17.4 mmen
dc.subjectSize 16.0 mmen
dc.subjectSize 0.5 mmen
dc.subjectWavelength 1300.0 nmen
dc.subjectOptical fibersen
dc.subjectPhotonicsen
dc.subjectOptical couplingen
dc.title128 × 128 silicon photonic MEMS switch package using glass interposer and pitch reducing fibre arrayen
dc.typeArticle (peer-reviewed)en
dc.typeConference itemen
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