Patterned InterVia for heterogeneous integration of III-V devices onto silicon photonics by using micro-transfer printing

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Date
2023
Authors
Uzun, Ali
Rimböck, Johanna
Gasiorowski, Jacek
Farrell, Alex
Fecioru, Alin
Loi, Ruggero
Corbett, Brian
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Keywords
InterVia , Heterogeneous Integration of III-V devices onto silicon photonics , Micro-transfer printing
Citation
Uzun, A., Rimböck, J., Gasiorowski, J., Farrell, A., Fecioru, A., Loi, R., and Corbett, B. (2023) 'Patterned InterVia for heterogeneous integration of III-V devices onto silicon photonics by using micro-transfer printing', 2023 IEEE International 3D Systems Integration Conference (3DIC), Cork, Ireland, 10-12 May.
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https://3dic-conf.org/
URI
https://hdl.handle.net/10468/15456
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Tyndall National Institute - Conference Items
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© 2023, the Authors.