Patterned InterVia for heterogeneous integration of III-V devices onto silicon photonics by using micro-transfer printing

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dc.contributor.authorUzun, Alien
dc.contributor.authorRimböck, Johannaen
dc.contributor.authorGasiorowski, Jaceken
dc.contributor.authorFarrell, Alexen
dc.contributor.authorFecioru, Alinen
dc.contributor.authorLoi, Ruggeroen
dc.contributor.authorCorbett, Brianen
dc.contributor.funderHorizon 2020en
dc.contributor.funderScience Foundation Irelanden
dc.date.accessioned2024-01-30T14:44:34Z
dc.date.available2024-01-30T14:44:34Z
dc.date.issued2023en
dc.description.statusPeer revieweden
dc.description.versionAccepted Versionen
dc.format.mimetypeapplication/pdfen
dc.identifier.citationUzun, A., Rimböck, J., Gasiorowski, J., Farrell, A., Fecioru, A., Loi, R., and Corbett, B. (2023) 'Patterned InterVia for heterogeneous integration of III-V devices onto silicon photonics by using micro-transfer printing', 2023 IEEE International 3D Systems Integration Conference (3DIC), Cork, Ireland, 10-12 May.en
dc.identifier.endpage2en
dc.identifier.startpage1en
dc.identifier.urihttps://hdl.handle.net/10468/15456
dc.language.isoenen
dc.relation.ispartof2023 IEEE International 3D Systems Integration Conference (3DIC), Cork, Ireland, 10-12 Mayen
dc.relation.projectinfo:eu-repo/grantAgreement/EC/H2020::IA/825453/EU/Micro assembled Terabit/s capable optical transceivers for Datacom applications/Caladanen
dc.relation.projectinfo:eu-repo/grantAgreement/SFI/SFI Research Centres Programme::Phase 2/12/RC/2276_P2/IE/IPIC_Phase 2/en
dc.relation.urihttps://3dic-conf.org/en
dc.rights© 2023, the Authors.en
dc.rights.urihttps://creativecommons.org/licenses/by/4.0/en
dc.subjectInterViaen
dc.subjectHeterogeneous Integration of III-V devices onto silicon photonicsen
dc.subjectMicro-transfer printingen
dc.titlePatterned InterVia for heterogeneous integration of III-V devices onto silicon photonics by using micro-transfer printingen
dc.typeConference itemen
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